Nanotechnology is considered one of the key technologies of the 21st century. The increasing miniaturisation is first and foremost affecting the semiconductor industry. Ever finer structure sizes enable ever better chip performance.
The performance requirements for modern semiconductor components are constantly increasing. As a result, ever better high-performance measurement technology for the nano and subnanometre range is indispensable. Including technology that is as innovative as it gets.
State-of-the-art measurement methods follow different approaches. However, most of them have significant weaknesses:
Our research and development team has dedicated itself to these problems - with revolutionary results that we have integrated into our „Global Nanoscope“ metrology system.
Measuring the entire surface at once without stitching: Our newly developed method bridges the gap between all previously used measurement methods in the field of nanometric measurement of specular surfaces. At present, we can measure nanostructures on wafers with a diameter of up to 300 mm within 60 seconds.
Reliable measurement - regardless of vibrations: The fully motionless and contactless, non-destructive surface inspection is another advantage. The system has proven to be fully robust against external influences such as vibrations. There are no moving parts during the inspection.
Qualitative and quantitative measurement results at once: Standard Makyoh images provide two-dimensional, blurred images. The system based on E+H Advanced Makyoh gains real height information of the surface. It enables us to perform both a qualitative and a quantitative measurement.
Taken from our 3D software Waferstudio: Nanometric surface measurement based on our Advanced Makyoh process.
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